New LED architectures and phosphor technologies lower costs and boost quality

Over the last year, we have definitely seen the levels of solid-state lighting (SSL) adoption increasing with widespread installations, as industry analysts have been predicting for several years now. We are seeing installations ranging from street lighting to parking garages, from expanded uses in retail and hospitality applications to commercial and industrial applications. The technologies being incorporated, the applications, and the range of installations are growing dramatically. Still, light quality and component cost remain issues for the LED industry, and new chip architectures and phosphor- application techniques can deliver benefits in both regards.
Indeed, the increased demand for SSL is pressuring the industry to simultaneously improve quality, lower costs, and reduce manufacturing complexity throughout the supply chain. In response to these pressures, new led high bay light price technologies are being developed across the full range of chip fabrication techniques, starting with a new generation of semiconductor capital equipment, improved process engineering, and the development of advanced materials. In this vein, Intematix is ​​focused on engineering more rugged and efficient phosphor materials, as well as phosphor-application schemes, to reduce manufacturing cost and complexity while improving light quality.
Phosphor pre-formed films
In one innovative example of new technologies, phosphors are being manufactured into pre-formed polymer film sheets or glass tiles. We will even study the use of optical-ceramic materials that may be applied directly onto the light-emitting surface of LED chips. The promise of these novel manufacturing technologies is to eventually enable wafer-level packaging (WLP) of LED chips. WLP promises to lower chip manufacturing costs by eliminating redundant packaging steps while simultaneously improving  cree xsp series led street light efficacy, reliability, and quality. Ultimately, these technologies, combined with improved manufacturing systems and processes, could lead to the elimination of binning - producing white LED chips with a performance variance within 2 SDCM (standard deviation of color matching or a two-step MacAdam ellipse).
Still in development, these manufacturing techniques are currently being tested on flip-chip LED architectures, where both positive and negative contacts are on the bottom of the chip. Fig. 1 depicts a Samsung flip-chip LED with a uniform light-emitting surface. Samsung announced the architecture in a keynote address at the Strategies in Light 2014 conference.

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